Publications

2024
K.A. Pareek, D. May, P. Meszmer, M. Abo Ras and B. Wunderle. Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography. Journal of Intelligent Manufacturing (2024), P.1-27.
DOI: 10.1007/s10845-024-02326-1
2023
P. Meszmer, N. Mundada, M. Tavakolibasti and B. Wunderle. AI surrogate models for error analysis in optical systems. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 24th international conference on (2023), P.1-9.
DOI: 10.1109/EuroSimE56861.2023.10100829
M. Tavakolibasti, P. Meszmer, G. Böttger, M. Kettelgerdes, G. Elger, H. Erdogan, A. Seshaditya and B. Wunderle. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. Microelectronics Reliability (2023).
DOI: 10.1016/j.microrel.2022.114871
M. Kettelgerdes, P. Mezmer, M.J. Haeussler, G. Böttger, M. Tavakolibasti, A. Pandey, H. Erdogan, G. Elger, R. Schacht und B. Wunderle. Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA (2023) P.753-760.
DOI: 10.1109/ECTC51909.2023.00131
2022
P. Meszmer, A. Prisacaru, P. J. Gromala and B. Wunderle. Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), P.1-11.
DOI: 10.1109/EuroSimE54907.2022.9758844
M. Tavakolibasti, P. Meszmer, M. Kettelgerdes, G. Böttger, G. Elger, H. Erdogan, A. Seshaditya and B. Wunderle. Structural-Thermal-Optical-Performance (STOP) Analysis of a Lens Stack for Realization of a Digital Twin of an automotive LiDAR. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), P.1-7.
DOI: 10.1109/EuroSimE54907.2022.9758897
K. A. Pareek, D. May, P. Meszmer, M. A. Ras and B. Wunderle. Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), P.1-8.
DOI: 10.1109/EuroSimE54907.2022.9758902
2021
P. Meszmer, M. Majd, A. Prisacaru, P. J. Gromala and B. Wunderle. Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison. Microelectronics Reliability (2021)
DOI: 10.1016/j.microrel.2021.114181
M. Tavakolibasti, P. Meszmer, G. Böttger, M. Kettelgerdes, G. Elger, H. Erdogan, A. Seshaditya and B. Wunderle. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 22nd international conference on, 2021, P.1-9.
DOI: 10.1109/EuroSimE52062.2021.9410831
2020
B. Wunderle, P. Meszmer, A. Mohnot, M. Tavakolibasti, N. Jöhrmann, U. Zschenderlein, J. Arnold, S. Voigt, J. Mehner and R. Ecke. Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 21st international conference on, 2020, P.1-7.
DOI: 10.1109/EuroSimE48426.2020.9152734
M. Majd, P. Meszmer, A. Priscaru, P. J. Gromala and B. Wunderle. Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 21st international conference on, 2020, P.1-10.
DOI: 10.1109/EuroSimE48426.2020.9152697
2019
P. Meszmer, S. Hahn, K. Hiller and B. Wunderle. Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201800936
E. Sheremet, P. Meszmer, T. Blaudeck, S. Hartmann, C. Wagner, B. Ma, S. Hermann, B. Wunderle, S.E. Schulz, M. Hietschold, R.D. Rodriguez and D.R.T. Zahn. Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nanoscale. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900106
C. Wagner, T. Blaudeck, P. Meszmer, S. Böttger, S. Hermann, J. Schuster, B. Wunderle and S. E. Schulz. Carbon nanotubes for mechanical sensor applications. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900584
R.D. Rodriguez, Z. Khan, B. Ma, A. Mukherjee, P. Meszmer, J. Kalbacova, E. Garratt, H. Shah, J. Heilmann, A.R. Hight Walker, B. Wunderle, E. Sheremet, M. Hietschold and D.R.T. Zahn. Ion-Induced Defects in Graphite: A Combined Kelvin Probe and Raman Microscopy Investigation. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900055
2017
P. Meszmer, R.D. Rodriguez, E. Sheremet, D.R.T. Zahn and B. Wunderle. Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. Microelectronics Reliability, 79 (2017), P.104-110.
DOI: 10.1016/j.microrel.2017.10.010
2016
P. Meszmer, K. Hiller, R.D. Rodriguez, E. Sheremet, D.R.T. Zahn, M. Hietschold and B. Wunderle. Raman Based Stress Analysis of the Active Areas of a Piezoresistive MEMS Force Sensor - Experimental Setup, Data Processing, and Comparison to Numerically Obtained Results.Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 17th international conference on, 2016, P.1-11.
DOI: 10.1109/EuroSimE.2016.7463340
2015
S. Hartmann, A. Shaporin, S. Hermann, J. Bonitz, M. Heggen, P. Meszmer, H. Sturm, O. Hölck, T. Blaudeck, S.E. Schulz, J. Mehner, T. Gessner and B. Wunderle. Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics.Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 16th international conference on, 2015, P.1-8.
DOI: 10.1109/EuroSimE.2015.7103119
2014
P. Meszmer, K. Hiller, A. Shaporin, J. Mehner and B. Wunderle. Mikro-und nanoskalige Zug- und Ermüdungstests in einem probenzentrischen Design. 12. Chemnitzer Fachtagung Mikrosystemtechnik (MST2014), 2014, P.142-149.
ISBN: 978-3-00-047625-9
P. Meszmer, K. Hiller, D. May, S. Hartmann, A. Shaporin, J. Mehner and B. Wunderle. Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 15th international conference on, 2014, P.1-10.
DOI: 10.1109/EuroSimE.2014.6813843
P. Meszmer, K. Hiller, S. Hartmann, A. Shaporin, D. May, R.D. Rodriguez, J. Arnold, G. Schondelmaier, J. Mehner, D.R. Zahn, B. Bernhard. Numerical Characterization and Experimental Verification of an In-plane MEMS-actuator with Thin-film Aluminum Heater Microsystem Technologies 20 (2014) 6 P.1041-1050.
DOI: 10.1007/s00542-014-2143-6
P. Meszmer. Hierarchical quadrature for multidimensional singular integrals: part II. Journal of numerical mathematics, 22 (2014) 1, P.33-60.
Preprint (MIS): 71/2012 DOI: 10.1515/jnum-2014-0002
2012
P. Meszmer. Hierarchische Integration und der Strahlungstransport in streuenden Medien. PhD thesis, Universität Leipzig, 2012.
URN: urn:nbn:de:bsz:15-qucosa-98584
J. Ballani and P. Meszmer. Tensor structured evaluation of singular volume integrals. Computing and Visualization in Science, 15 (2012) 2, P.75-86.
Preprint (MIS): 70/2012 DOI: 10.1007/s00791-013-0199-y
2010
P. Meszmer. Hierarchical quadrature for multidimensional singular integrals. Journal of numerical mathematics, 18 (2010) 2, P.91-117.
Preprint (MIS): 5/2010 DOI: 10.1515/jnum.2010.004
2008
P. Meszmer. Verbesserte numerische Simulation von Indenter-Versuchen durch die Fourier-Finite-Elemente-Methode. Diploma thesis, Technische Universität Chemnitz, 2007.
URN: urn:nbn:de:bsz:ch1-200800109
BibTex-file

Publikationen

2024
K.A. Pareek, D. May, P. Meszmer, M. Abo Ras und B. Wunderle. Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography. Journal of Intelligent Manufacturing (2024), S.1-27.
DOI: 10.1007/s10845-024-02326-1
2023
P. Meszmer, N. Mundada, M. Tavakolibasti und B. Wunderle. AI surrogate models for error analysis in optical systems. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 24th international conference on (2023), S.1-9.
DOI: 10.1109/EuroSimE56861.2023.10100829
M. Tavakolibasti, P. Meszmer, G. Böttger, M. Kettelgerdes, G. Elger, H. Erdogan, A. Seshaditya und B. Wunderle. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. Microelectronics Reliability (2023).
DOI: 10.1016/j.microrel.2022.114871
M. Kettelgerdes, P. Mezmer, M.J. Haeussler, G. Böttger, M. Tavakolibasti, A. Pandey, H. Erdogan, G. Elger, R. Schacht und B. Wunderle. Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA (2023) S.753-760.
DOI: 10.1109/ECTC51909.2023.00131
2022
P. Meszmer, A. Prisacaru, P. J. Gromala und B. Wunderle. Data Augmentation for Improved Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), S.1-11
DOI: 10.1109/EuroSimE54907.2022.9758844
M. Tavakolibasti, P. Meszmer, M. Kettelgerdes, G. Böttger, G. Elger, H. Erdogan, A. Seshaditya und B. Wunderle. Structural-Thermal-Optical-Performance (STOP) Analysis of a Lens Stack for Realization of a Digital Twin of an automotive LiDAR. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), S.1-7
DOI: 10.1109/EuroSimE54907.2022.9758897
K. A. Pareek, D. May, P. Meszmer, M. A. Ras und B. Wunderle. Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 23rd international conference on (2022), S.1-8.
DOI: 10.1109/EuroSimE54907.2022.9758902
2021
P. Meszmer, M. Majd, A. Prisacaru, P. J. Gromala und B. Wunderle. Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison. Microelectronics Reliability (2021)
DOI: 10.1016/j.microrel.2021.114181
M. Tavakolibasti, P. Meszmer, G. Böttger, M. Kettelgerdes, G. Elger, H. Erdogan, A. Seshaditya und B. Wunderle. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 22nd international conference on, 2021, S.1-9.
DOI: 10.1109/EuroSimE52062.2021.9410831
2020
B. Wunderle, P. Meszmer, A. Mohnot, M. Tavakolibasti, N. Jöhrmann, U. Zschenderlein, J. Arnold, S. Voigt, J. Mehner und R. Ecke. Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 21st international conference on, 2020, S.1-7.
DOI: 10.1109/EuroSimE48426.2020.9152734
M. Majd, P. Meszmer, A. Priscaru, P. J. Gromala und B. Wunderle. Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 21st international conference on, 2020, S.1-10.
DOI: 10.1109/EuroSimE48426.2020.9152697
2019
P. Meszmer, S. Hahn, K. Hiller und B. Wunderle. Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements − Technology and Functional Test Results. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201800936
E. Sheremet, P. Meszmer, T. Blaudeck, S. Hartmann, C. Wagner, B. Ma, S. Hermann, B. Wunderle, S.E. Schulz, M. Hietschold, R.D. Rodriguez und D.R.T. Zahn. Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nanoscale. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900106
C. Wagner, T. Blaudeck, P. Meszmer, S. Böttger, S. Hermann, J. Schuster, B. Wunderle und S. E. Schulz. Carbon nanotubes for mechanical sensor applications. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900584
R.D. Rodriguez, Z. Khan, B. Ma, A. Mukherjee, P. Meszmer, J. Kalbacova, E. Garratt, H. Shah, J. Heilmann, A.R. Hight Walker, B. Wunderle, E. Sheremet, M. Hietschold und D.R.T. Zahn. Ion-Induced Defects in Graphite: A Combined Kelvin Probe and Raman Microscopy Investigation. Phys. Status solidi A (2019)
DOI: 10.1002/pssa.201900055
2017
P. Meszmer, R.D. Rodriguez, E. Sheremet, D.R.T. Zahn und B. Wunderle. Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy. Microelectronics Reliability, 79 (2017), S.104-110.
DOI: 10.1016/j.microrel.2017.10.010
2016
P. Meszmer, K. Hiller, R.D. Rodriguez, E. Sheremet, D.R.T. Zahn, M. Hietschold und B. Wunderle. Raman Based Stress Analysis of the Active Areas of a Piezoresistive MEMS Force Sensor - Experimental Setup, Data Processing, and Comparison to Numerically Obtained Results.Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 17th international conference on, 2016, S.1-11.
DOI: 10.1109/EuroSimE.2016.7463340
2015
S. Hartmann, A. Shaporin, S. Hermann, J. Bonitz, M. Heggen, P. Meszmer, H. Sturm, O. Hölck, T. Blaudeck, S.E. Schulz, J. Mehner, T. Gessner und B. Wunderle. Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics.Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 16th international conference on, 2015, S.1-8.
DOI: 10.1109/EuroSimE.2015.7103119
2014
P. Meszmer, K. Hiller, A. Shaporin, J. Mehner und B. Wunderle. Mikro- und nanoskalige Zug- und Ermüdungstests in einem probenzentrischen Design. 12. Chemnitzer Fachtagung Mikrosystemtechnik (MST2014), 2014, S.142-149
ISBN: 978-3-00-047625-9
P. Meszmer, K. Hiller, D. May, S. Hartmann, A. Shaporin, J. Mehner und B. Wunderle. Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor. Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 15th international conference on, 2014, S.1-10.
DOI: 10.1109/EuroSimE.2014.6813843
P. Meszmer, K. Hiller, S. Hartmann, A. Shaporin, D. May, R.D. Rodriguez, J. Arnold, G. Schondelmaier, J. Mehner, D.R. Zahn, B. Bernhard. Numerical Characterization and Experimental Verification of an In-plane MEMS-actuator with Thin-film Aluminum Heater Microsystem Technologies 20 (2014) 6 S.1041-1050.
DOI: 10.1007/s00542-014-2143-6
P. Meszmer. Hierarchical quadrature for multidimensional singular integrals: part II. Journal of numerical mathematics, 22 (2014) 1, S.33-60.
Preprint (MIS): 71/2012 DOI: 10.1515/jnum-2014-0002
2012
P. Meszmer. Hierarchische Integration und der Strahlungstransport in streuenden Medien. Dissertation, Universität Leipzig, 2012.
URN: urn:nbn:de:bsz:15-qucosa-98584
J. Ballani und P. Meszmer. Tensor structured evaluation of singular volume integrals. Computing and Visualization in Science, 15 (2012) 2, S.75-86.
Preprint (MIS): 70/2012 DOI: 10.1007/s00791-013-0199-y
2010
P. Meszmer. Hierarchical quadrature for multidimensional singular integrals. Journal of numerical mathematics, 18 (2010) 2, S.91-117.
Preprint (MIS): 5/2010 DOI: 10.1515/jnum.2010.004
2008
P. Meszmer. Verbesserte numerische Simulation von Indenter-Versuchen durch die Fourier-Finite-Elemente-Methode. Diplomarbeit, Technische Universität Chemnitz, 2007.
URN: urn:nbn:de:bsz:ch1-200800109
BibTex-Datei